November 21, 2024
Dyes & Chemicals

Covestro Exhibiting Innovative Material Solutions At Techtextil

Polymer manufacturer Covestro is exhibiting a wide range of innovative material solutions for the textile industry at Techtextil 2024 in Frankfurt in Hall 11.0, Booth E76.

Covestro teams are presenting a selection of highlights from its portfolio that can help textile manufacturers improve the productivity and sustainability of their operations and products.

From more sustainable raw materials to textile recycling technologies, Covestro is supporting the coated textiles value chain in its sustainability transformation thanks to its waterborne Insqin technology.

Exhibits include a new concept for automotive interior door panels, breathable vegan coatings for functional textiles, and a next-generation, partly bio-based leather alternative made using apple waste.

With its Platilon and Dureflex film solutions, Covestro helps makers of sportswear and outdoor gear overcome the challenge of balancing processing efficiency, high performance, and consumer safety.

The team will showcase the combined power of these thermoplastic polyurethane (TPU) films in inflatable surfing kites and wings, enabling reliably excellent performance.

Durable, versatile, soft touch, and more sustainable, Covestro’s recyclable thermoplastic polyurethane (TPU) Desmopan is a mono-material solution that offers strong mechanical and sustainability properties.

Techtextil visitors will discover the benefits of Desmopan in more circular truck tarps, attractive artificial leather and high-performance yarns that help meet the demands of the fashion industry.

“With our wide-ranging selection of high-performance solutions, Covestro’s booth will be an essential destination for Techtextil visitors,” said Thomas Michaelis, Head of Textile Coating in (EMLA) region.

“We are excited to show our latest textile innovations in different markets and applications which enable a more efficient, more sustainable textile value chain,” he added.

Related Posts

Leave a Reply

Your email address will not be published. Required fields are marked *