December 22, 2024
Machinery

Dilo Organises Tour Of R&D Centre On Sidelines Of Techtextil

On the sidelines of the just concluded Techtextil 2024, DiloGroup arranged a tour of its headquarters in Eberbach as a supplementary event.

More than 80 visitors took the audio-guided tour through the company’s R&D and demonstration centres.

Complete lines and individual machinery were on display in a space of approximately 3,100 sq. metres and included the MicroPunch S research and demonstration line for needling light.

MultiCard MCRR CC with FRS-P feeder was on display which was returned from ITMA and reinstalled for the product development of hygiene, cosmetic, medical and technical lightweight nonwovens.

This line was accompanied by a Hypertex line for the production of lightweight sandwiches of reinforced nonwoven layers to increase strength and stiffness in MD and CD directions.

Applications include needled filtration and roofing material as well as shoe and garment applications.

The layered mesh of filament or yarn is laid inline between a base and a cover of pre-needled material with speeds up to ca. 40 m/min.

According to the German company, the MicroPunch S intensive needling line can thus be combined with the Hypertex process to include all areas of applications for lightweights needled from fine fibre.

In Technology Centres I and II, three complete nonwovens lines ran demonstrations including a 7 metre wide needling line consisting of the VQC Card (Quadro).

It also included the high speed DLSC three apron layer capable of 200 m/min infeed speed and the 7 metre wide pre-needler. A HyperPunch machine in 3.5 metre, too was included in the demonstration.

At the aerodynamic web forming section additive manufacturing was on display through the 3D-Lofter which comprises a series of individual web formers programmable to lay down additional fibre material.

The guided tours included enough time to get in depth insight of machines, technologies and textile products which also were on display and given as samples along with technical literature.

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